Diamond wheel for grinding SiC surfaces "M-cloud"
These are metal-bonded wheels designed for grinding the surfaces of wafers, including SiC and GaN. Their ultra-porous structure enables fine-grit grinding that was previously impossible with conventional metal-bonded wheels, and they offer superior cutting performance and wear resistance compared to vitrified-bonded wheels of the same grit size.
Sharpness-oriented electroplated wheel "AG Wheel"
AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
Electroplated Wheels for Form Grinding "SUN CREST2"
An electroplated wheel featuring helical grooves on its outer surface, designed specifically for machining operations that require a sharp cutting edge.
High-efficiency Metal Bond for Difficult-to-cut Materials "SUNCREA"
SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.
Super-Porous Metal Bond Wheels "AEROMETAL"
Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
Mirror Finish Grinding / Simultaneous grinding of different materials "FINEMASTER"
The FINE MASTER series is a wheel that uses "BFM bond" for simultaneous grinding that realizes simultaneous grinding of heterogeneous composite materials such as tungsten carbide and steel materials with high efficiency and high precision, and "BFS bond" for mirror finishing, which realizes mirror grinding of tungsten carbide, steel materials, ceramics, etc. with high efficiency and high precision.
Double Disc Centerless Grinding Wheels "TafRa"
TafRa wheels are Products with higher abrasive grain retention compared to exciting products. In Double disc grinding and centerless grinding, where the spontaneous action of abrasive grains is unlikely to occur, The abrasive grains remain for a long time without falling off, so that the sharpness is maintained and the dress interval is extended. As with existing products, it can be applications with WA dresses and X-POWER dresses.
Electroplated Reamer (for one-pass honing)
High-precision electroplated reamer with micron-level control of tool outer diameter accuracy and good machining accuracy.
Using a machining center that does not require a dedicated machine, high-efficiency is achieved by one-pass processing.
Using a machining center that does not require a dedicated machine, high-efficiency is achieved by one-pass processing.
Brazed Diamond Tools "STAR LAYER"
Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.
Electroplated Wheels "Ceramate Series"
An electroplated-shaft wheel specialized for machining ceramics used in semiconductor manufacturing equipment components, offering high precision, high efficiency, a long service life, and consistent cutting performance.The Ceramate Drill, designed exclusively for center-through tools, offers excellent cooling performance and achieves high-efficiency machining at groundbreaking speeds; the Ceramate End Mill for grooving; the Ceramate Tap, a thread-cutting tool capable of JIS Class 2 precision (M3–M12) that reduces the number of threads by half to minimize tool load; and the Ceramate Contouring tool, a high-efficiency contouring tool capable of high-feed-rate machining.
Abrasive Grain Uniform Dispersion Metal Wheel "SOLOTERU"
In the machining of precision parts and mechanical components made from materials such as ceramics, a technology that uniformly disperses the abrasive grains within the abrasive layer has made it possible to improve cutting performance while extending tool life compared to conventional metal tools.
Furthermore, by making the abrasive layer ultra-thin, these tools reduce machining load and minimize chipping—even when machining hard and brittle materials and other specialty materials—thereby improving machining efficiency and demonstrating superior performance compared to other tools.
Furthermore, by making the abrasive layer ultra-thin, these tools reduce machining load and minimize chipping—even when machining hard and brittle materials and other specialty materials—thereby improving machining efficiency and demonstrating superior performance compared to other tools.
High Elastic Resin Bond Wheel "BRIGHT STAR"
Bright Star is a superabrasive wheel with a special bond structure that has a high elasticity not found in conventional resin bonds, and is effective for processing that requires luster. BRS2 Bond is a hard type that is effective for processes that require a certain amount of material to be removed, and is compatible with both lapping and grinding. BRS5 bond is a soft type and is effective for polishing processes such as lapping and polishing.