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This is a core drill designed for drilling holes in automotive glass, which plays a crucial role in improving vehicle safety. It features a chamfering section that performs chamfering simultaneously with drilling, helping to streamline the manufacturing process.

These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

This core drill offers superior precision and cutting performance. It is suitable for a wide range of materials, including LED substrates, semiconductor materials such as sapphire, and ceramics.

These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.