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This core drill is used for drilling holes in automotive glass, which plays an important role in improving automobile safety. It is equipped with a seamer section that drills holes and performs chamfering at the same time.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1point) or 2, 3, 4, 8 point cutting edges, depending on the application. Since coolant is not used, treatment facilities are not necessary, and the thin scribe line allows many "chip count" to be obtained. Chipping during breaking is less likely to occur than when using a cutter, and the optimum point shape can be selected.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

Core drill with excellent accuracy and sharpness, suitable for various work materials such as LED substrate materials, semiconductor materials such as sapphire, ceramics, etc.

These blades are used in the forming process (squaring) of monocrystalline silicon ingots for solar cells and in the process of removing the impurity layer (cropping) of polycrystalline silicon ingots for solar cells. There are three types of blades: a standard type with a good balance between sharpness and long life, a slit type that prioritizes processing efficiency and sharpness, and a wave type with special specifications aimed at reducing chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.