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Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

Wheel with electroplated shaft that is specialized for machining ceramics used in semiconductor manufacturing equipment parts, etc., and provides stable sharpness with high accuracy, high efficiency, and long life. The Ceramate Drill dedicated to the center-through type with high cooling effect and revolutionary machining speed for highly efficient machining, the Ceramate End Mill as a grooving tool, the Ceramate Tap as a threading tool capable of machining JIS Class 2 precision (M3 to M12) screws with half the number of threads to reduce tool load, and the Ceramate High Speed Cutting Tool for high efficiency contour cutting. The Ceramate Contouring is a high-efficiency contouring tool that enables high-speed feed machining.

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

Small-diameter formed wheels are used to finish the notches of large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and realize a favorable wafer circumference. As with our edge grinding wheels, we are able to provide a wide variety of specifications, including single-grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of silicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. We are able to provide a wide variety of specifications, including single grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Diamond metal wheels and diamond resin wheels are used for grinding silicon ingots for solar cells and semiconductors. Based on our experience in various fields, we offer wheels that meet the needs of our customers and the machines they own.

In the machining of precision parts and mechanical parts made of ceramics and other materials, the technology of uniformly dispersing abrasive grains in the abrasive grain layer has made it possible to improve sharpness while maintaining a long service life, compared to conventional metal tools.
In addition, the ultra-thin abrasive grain layer reduces machining load and chipping in the machining of hard and brittle materials and other special materials, thereby improving machining efficiency and demonstrating its superiority over other tools.

Vitrified grinding wheel using general abrasive grains. A wide variety of wheel configurations from soft to hard are possible, and they are effective as dressing materials for metal tools.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1point) or 2, 3, 4, 8 point cutting edges, depending on the application. Since coolant is not used, treatment facilities are not necessary, and the thin scribe line allows many "chip count" to be obtained. Chipping during breaking is less likely to occur than when using a cutter, and the optimum point shape can be selected.