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We have achieved smaller diameters (φ0.3–1.5) for PCD drills, which are essential for high-precision machining of hard and brittle materials such as SiC and cemented carbide. With the drill tip composed entirely of PCD, these drills offer a long service life and minimize chipping during drilling. They meet the next-generation requirements for semiconductor-related components, precision mold parts, and other applications.

We have developed a multi-flute end mill (φ1–φ3) with cutting edges made entirely of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. A key feature of this tool is its high number of flutes—25 in total—despite its small diameter of φ3.

These are metal-bonded wheels designed for grinding the surfaces of wafers, including SiC and GaN. Their ultra-porous structure enables fine-grit grinding that was previously impossible with conventional metal-bonded wheels, and they offer superior cutting performance and wear resistance compared to vitrified-bonded wheels of the same grit size.

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

An electroplated-shaft wheel specialized for machining ceramics used in semiconductor manufacturing equipment components, offering high precision, high efficiency, a long service life, and consistent cutting performance.The Ceramate Drill, designed exclusively for center-through tools, offers excellent cooling performance and achieves high-efficiency machining at groundbreaking speeds; the Ceramate End Mill for grooving; the Ceramate Tap, a thread-cutting tool capable of JIS Class 2 precision (M3–M12) that reduces the number of threads by half to minimize tool load; and the Ceramate Contouring tool, a high-efficiency contouring tool capable of high-feed-rate machining.

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

Small-diameter formed wheels are used to finish the notches of large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and realize a favorable wafer circumference. As with our edge grinding wheels, we are able to provide a wide variety of specifications, including single-grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of silicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. We are able to provide a wide variety of specifications, including single grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Diamond metal wheels and diamond resin wheels are used for grinding silicon ingots for solar cells and semiconductors. Drawing on our proven track record across various industries, we provide wheels tailored to our customers’ needs and the machinery they use.

In the machining of precision parts and mechanical components made from materials such as ceramics, a technology that uniformly disperses the abrasive grains within the abrasive layer has made it possible to improve cutting performance while extending tool life compared to conventional metal tools.
Furthermore, by making the abrasive layer ultra-thin, these tools reduce machining load and minimize chipping—even when machining hard and brittle materials and other specialty materials—thereby improving machining efficiency and demonstrating superior performance compared to other tools.