Brazed Diamond Tools "STAR LAYER"
Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.
Wire Saws
A wire saw with a bead diameter of φ10 mm, suitable for demolishing concrete structures and processing precast products.The Hyper Snake series consists of five models available from standard stock: the “CS-PRO” ( excellent balance), the “CS-LIFE” (long service life), the “CS-SPEED” (suitable for concrete containing gravel or hard aggregates), the “CS-MAX” (suitable for concrete with high rebar content), and the “CS-DRY” (suitable for dry cutting).
Blade (General-Purpose)
These blades are highly versatile and suitable for constructing small sites using small cutter machines. The Merit, developed with emphasis on sharpness to asphalt and concrete, and the Merit Light, an economy type with excellent cost performance, are available in our standard inventory.
Blade (for asphalt)
These blades offer excellent cutting performance and straight-line stability, making them suitable for a wide variety of asphalt roads across the country. We keep the “MV-Linear Series” for wet conditions and the “AK Series” for dry conditions in standard stock.
Blade (for concrete)
These blades feature excellent cutting performance and are suitable for a wide variety of concrete job sites.
IR ” for wet cutting.
We offer the “JD Series ” for dry cutting of joints and the “JW Series” for wet cutting.
IR ” for wet cutting.
We offer the “JD Series ” for dry cutting of joints and the “JW Series” for wet cutting.
Diamond Scriber
These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.
Cutter with Steel Core
Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.
Dicing Blade
There are two types of dicing blades: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It consists of an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type is,Various PKGsIt can be used for a wide range of cutting and grooving applications, including electronic component materials. You can choose from three types of bonds: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades as thin as 15 μm.Resin-bonded blades are widely used for cutting glass, ceramics, and various packaged components (such as QFNs) where chipping and cutting resistance must be minimized. For metal-bonded blades, you can select the bond best suited for each workpiece from a wide range of options—from high-rigidity types comparable to electroformed blades to types that offer superior cutting performance.
AA Diamond Technology Co., Ltd. manufactures hub-type dicing blades and provides high-quality products that meet a wide range of cutting needs.
Please visit the official website for more details.
https://www.aa-diatech.com/jp/
AA Diamond Technology Co., Ltd. manufactures hub-type dicing blades and provides high-quality products that meet a wide range of cutting needs.
Please visit the official website for more details.
https://www.aa-diatech.com/jp/
OD Blade
These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.
Portable Cutter
These cutters were developed with an emphasis on safety for use with hand-held machines, and can be used for a variety of work materials. The product lineup includes "Blue" for stone, "New Gold" and "Green" for concrete, "Econo-ARIX" for engine cutters, and many others.
Electroplated Band Saw
Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.
Blades
Blades for cutting various materials such as stone, refractory brick, and building materials. We select blades with excellent sharpness, long life, and processing accuracy according to the cutting machine and conditions. Sizes from 8" to 72" can be manufactured, and a quiet type of core is also available. "S-Cut" and "Prime Saw" are available in stock for stone materials, which are in high demand.