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Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

This wheel is used for grinding thin glass used in displays such as TVs, PCs, and smartphones.

In the machining of precision parts and mechanical components made from materials such as ceramics, a technology that uniformly disperses the abrasive grains within the abrasive layer has made it possible to improve cutting performance while extending tool life compared to conventional metal tools.
Furthermore, by making the abrasive layer ultra-thin, these tools reduce machining load and minimize chipping—even when machining hard and brittle materials and other specialty materials—thereby improving machining efficiency and demonstrating superior performance compared to other tools.

Bright Star is a superabrasive wheel with a special bond structure that has a high elasticity not found in conventional resin bonds, and is effective for processing that requires luster. BRS2 Bond is a hard type that is effective for processes that require a certain amount of material to be removed, and is compatible with both lapping and grinding. BRS5 bond is a soft type and is effective for polishing processes such as lapping and polishing.

"SUNBRIGHT" is a monocrystalline diamond cutting tool for ultra-precision cutting.
The sharp cutting edges and nano-order level contouring accuracy have been established through high-precision machining technology.
It can be used for various lens products, lens molds, and mirror finishing of non-ferrous metal products.

These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

This core drill offers superior precision and cutting performance. It is suitable for a wide range of materials, including LED substrates, semiconductor materials such as sapphire, and ceramics.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.