menu icon
x

Search by Industry

Composite Materials & Resins

Array Grain Electroplated Wheels "AG Wheel"

Array Grain Electroplated Wheels "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
Double Disc Centerless Grinding Wheels "TafRa"

Double Disc Centerless Grinding Wheels "TafRa"

TafRa wheels are Products with higher abrasive grain retention compared to exciting products. In Double disc grinding and centerless grinding, where the spontaneous action of abrasive grains is unlikely to occur, The abrasive grains remain for a long time without falling off, so that the sharpness is maintained and the dress interval is extended. As with existing products, it can be applications with WA dresses and X-POWER dresses.
Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.
CMP Conditioners

CMP Conditioners

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.
Diamond Coated Tools

Diamond Coated Tools

Our original coating technologies utilizing the chemical vapor deposition method can be applied on tools with any complicated shape while retraining both high adhesiveness to base metal and excellent wear resistance. With choice of the right type and thickness of coating depending on the application, these tools are most suitable for processing carbon, ceramics, and FRP.
PCD Drill

PCD Drill

To meet the market demand for higher productivity, we developed helical type drills with a diamond compact to achieve rapid feeding and reduces thrust. Also available are special types that solve exit burr and chip obstruction problems. They also enable process integration by adopting one-pass finish and multistep edges.
PCD/PCBN Endmill, Routers & Tipped Saw

PCD/PCBN Endmill, Routers & Tipped Saw

[Endmill]
Purposely designed edges to cater for your needs to improve the efficiency of various types of processing such as milling, grooving, spot facing, and curve facing. Also available are spiral types for high-speed cutting, high-precision ball shapes, and taps. Applications include high-precision and high-efficiency processing of metal molds, compressors, FRP, acrylic, etc.
[Routers & Tipped Saw]
They allow you to cut costs because they produce a long lasting surface finish in cutting, grooving, and boring of wood, building materials, printed-circuit boards, artificial marble, plastics, etc. and have a long life, Also, we meet a wide range of demands such as whole form processing by combining them.
PCD/PCBN Integrated Touring Holder Reamer

PCD/PCBN Integrated Touring Holder Reamer

By integrating the tooling holder and reamer into a single unit, tool length can be shortened and rigidity can be increased to meet high precision requirements. Also, we can be manufactured in accordance with various holder standards.
PCD/PCBN Reamer

PCD/PCBN Reamer

With stable quality based on control of outer diameter dimension and runout accuracy, which are the key elements of reamers, we can design for high precision requirements such as machined surface roughness, roundness, and coaxiality, as well as high-speed feed. We have a large lineup of products, from standard specifications to value-added specifications, to meet our customers' needs.
Monocrystalline DiaBite/Endmill "SUNBRIGHT"

Monocrystalline DiaBite/Endmill "SUNBRIGHT"

"SUNBRIGHT" is a monocrystalline diamond cutting tool for ultra-precision cutting.
The sharp cutting edges and nano-order level contouring accuracy have been established through high-precision machining technology.
It can be used for various lens products, lens molds, and mirror finishing of non-ferrous metal products.
Cutter with Steel Core

Cutter with Steel Core

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.
Dicing Blade

Dicing Blade

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

If you have any questions or concerns, please feel free to contact us at