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Electronics & Semiconductor

"Micro PCD Drill" for Drilling Holes in Hard, Brittle Materials

"Micro PCD Drill" for Drilling Holes in Hard, Brittle Materials

We have achieved smaller diameters (φ0.3–1.5) for PCD drills, which are essential for high-precision machining of hard and brittle materials such as SiC and cemented carbide. With the drill tip composed entirely of PCD, these drills offer a long service life and minimize chipping during drilling. They meet the next-generation requirements for semiconductor-related components, precision mold parts, and other applications.
Vitrified Diamond Grinding Wheels for Aspheric Lenses

Vitrified Diamond Grinding Wheels for Aspheric Lenses

Compared to conventional diamond resin-bonded grinding wheels, this diamond vitrified grinding wheel offers superior shape retention and is suitable for grinding difficult-to-machine materials such as cemented carbide and SiC molds, as well as for polishing glass materials.
PCD Multi-Edge End Mills for Machining Hard and Brittle Materials “PCD Multi Edges”

PCD Multi-Edge End Mills for Machining Hard and Brittle Materials “PCD Multi Edges”

We have developed a multi-flute end mill (φ1–φ3) with cutting edges made entirely of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. A key feature of this tool is its high number of flutes—25 in total—despite its small diameter of φ3.
Diamond wheel for grinding SiC surfaces "M-cloud"

Diamond wheel for grinding SiC surfaces "M-cloud"

These are metal-bonded wheels designed for grinding the surfaces of wafers, including SiC and GaN. Their ultra-porous structure enables fine-grit grinding that was previously impossible with conventional metal-bonded wheels, and they offer superior cutting performance and wear resistance compared to vitrified-bonded wheels of the same grit size.
Sharpness-oriented electroplated wheel "AG Wheel"

Sharpness-oriented electroplated wheel "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
Electroplated Wheels for Form Grinding "SUN CREST2"

Electroplated Wheels for Form Grinding "SUN CREST2"

An electroplated wheel featuring helical grooves on its outer surface, designed specifically for machining operations that require a sharp cutting edge.
High-efficiency Metal Bond for Difficult-to-cut Materials <span wg-1="">"SUNCREA"</span>

High-efficiency Metal Bond for Difficult-to-cut Materials "SUNCREA"

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.
Super-Porous Metal Bond Wheels <span wg-1="">"AEROMETAL"</span>

Super-Porous Metal Bond Wheels "AEROMETAL"

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.
Electroplated Wheels "Ceramate Series"

Electroplated Wheels "Ceramate Series"

An electroplated-shaft wheel specialized for machining ceramics used in semiconductor manufacturing equipment components, offering high precision, high efficiency, a long service life, and consistent cutting performance.The Ceramate Drill, designed exclusively for center-through tools, offers excellent cooling performance and achieves high-efficiency machining at groundbreaking speeds; the Ceramate End Mill for grooving; the Ceramate Tap, a thread-cutting tool capable of JIS Class 2 precision (M3–M12) that reduces the number of threads by half to minimize tool load; and the Ceramate Contouring tool, a high-efficiency contouring tool capable of high-feed-rate machining.
CMP Conditioners

CMP Conditioners

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.
Diamond Wheel for Precision Grinding of Optical Glass

Diamond Wheel for Precision Grinding of Optical Glass

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

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