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Electronics & Semiconductor

Micro PCD Drill for Hard and Brittle Materials

Micro PCD Drill for Hard and Brittle Materials

Achieving miniaturization (φ0.3–1.5) of PCD drills essential for high-precision machining of hard and brittle materials like SiC and cemented carbide. The drill tip is entirely constructed of PCD, enabling long-life drilling with reduced chipping. Meeting the next-generation demands for semiconductor-related components, precision mold parts, and more.
Vitrified diamond grinding wheel for aspheric lenses

Vitrified diamond grinding wheel for aspheric lenses

Compared to conventional diamond resin abrasive wheels, this diamond vitrified abrasive wheel offers superior shape retention. It is suitable for difficult-to-machine materials such as cemented carbide molds and SiC molds, as well as for grinding glass materials.
PCD Multi-Edge End Mill for Machining Hard and Brittle Materials

PCD Multi-Edge End Mill for Machining Hard and Brittle Materials

We have developed a multi-flute end mill (φ1 to φ3) with all cutting edges made of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. Its key feature is the high number of flutes—25 flutes on the φ3 diameter—despite its small size.
Diamond wheel for grinding SiC surfaces "M-cloud"

Diamond wheel for grinding SiC surfaces "M-cloud"

Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.
Sharpness-oriented electroplated wheel "AG Wheel"

Sharpness-oriented electroplated wheel "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
Electroplated Wheels for Form Grinding "SUN CREST2"

Electroplated Wheels for Form Grinding "SUN CREST2"

Electroplated wheels are equipped with thread-like irregularities on the outer circumferential surface and are specialized for processing that requires sharpness.
High-efficiency Metal Bond for Difficult-to-cut Materials <span wg-1="">"SUNCREA"</span>

High-efficiency Metal Bond for Difficult-to-cut Materials "SUNCREA"

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.
Super-Porous Metal Bond Wheels <span wg-1="">"AEROMETAL"</span>

Super-Porous Metal Bond Wheels "AEROMETAL"

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER"

Brazed Diamond Tools "STAR LAYER" (Our registered trademark name: STAR LAYER) are tools that have a structure ㏌ which diamond abrasive grains are fixed ㏌ a single layer on a precisely machined base metal using brazing material. In contrast to electroplated tools, the abrasive grains are firmly bonded to the base metal, giving them strong retention strength and a large protrusion. In addition, the arrangement and spacing of the abrasive grains can be adjusted, and by taking advantage of the improved sharpness and the characteristics of being less prone to clogging, it can be used for a variety of applications and tool shapes (Diamond Core Drills, Diamond Cutters, Diamond Wheels, etc.) from rough processing to finishing processing.
Electroplated Wheels "Ceramate Series"

Electroplated Wheels "Ceramate Series"

Wheel with electroplated shaft that is specialized for machining ceramics used in semiconductor manufacturing equipment parts, etc., and provides stable sharpness with high accuracy, high efficiency, and long life. The Ceramate Drill dedicated to the center-through type with high cooling effect and revolutionary machining speed for highly efficient machining, the Ceramate End Mill as a grooving tool, the Ceramate Tap as a threading tool capable of machining JIS Class 2 precision (M3 to M12) screws with half the number of threads to reduce tool load, and the Ceramate High Speed Cutting Tool for high efficiency contour cutting. The Ceramate Contouring is a high-efficiency contouring tool that enables high-speed feed machining.
CMP Conditioners

CMP Conditioners

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.
Diamond Wheel for Precision Grinding of Optical Glass

Diamond Wheel for Precision Grinding of Optical Glass

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

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