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Electroplated Diamond Wire "EcoMEP"

Electroplated Diamond Wire "EcoMEP"

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.
Super-Porous Metal Bond Wheel "M-cloud"

Super-Porous Metal Bond Wheel "M-cloud"

Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.
Diamond Wheels for Various Wafer Surface Grinding

Diamond Wheels for Various Wafer Surface Grinding

This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.
Array Grain Electroplated Wheels "AG Wheel"

Array Grain Electroplated Wheels "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
Electroformed Roller Dresser for Specialized Performance in Sharpness "KD Dresser"

Electroformed Roller Dresser for Specialized Performance in Sharpness "KD Dresser"

In addition to the iSTroll, which has been well-received in machining requiring excellent cutting performance, the newly developed KD Dresser boasts cutting performance that exceeds that of the iSTroll. It is an electroformed roller dresser of a high precision total type with a high cutting ability and an abrasive grain array type roller dresser.
CBN Electroplated Wheels for High-Precision Grinding

CBN Electroplated Wheels for High-Precision Grinding

CBN electroplated wheel suitable for machining high-precision gross shapes by truing after Electroplated. No adjustment on the machine is required, and Ra 0.8μm or less and shape accuracy of ±0.005mm can be achieved.
Super-Porous Metal Bond Wheels <span wg-1="">"AEROMETAL"</span>

Super-Porous Metal Bond Wheels "AEROMETAL"

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
High-efficiency Metal Bond for Difficult-to-cut Materials <span wg-1="">"SUNCREA"</span>

High-efficiency Metal Bond for Difficult-to-cut Materials "SUNCREA"

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.
Electroplated Wheels for Form Grinding "SUN CREST2"

Electroplated Wheels for Form Grinding "SUN CREST2"

Electroplated wheels are equipped with thread-like irregularities on the outer circumferential surface and are specialized for processing that requires sharpness.
Simultaneous Grinding & Mirror Fishing "FINE MASTER"

Simultaneous Grinding & Mirror Fishing "FINE MASTER"

The FINE MASTER series is a wheel that uses "BFM bond" for simultaneous grinding that realizes simultaneous grinding of heterogeneous composite materials such as tungsten carbide and steel materials with high efficiency and high precision, and "BFS bond" for mirror finishing, which realizes mirror grinding of tungsten carbide, steel materials, ceramics, etc. with high efficiency and high precision.
Double Disc Centerless Grinding Resin Bond Wheels "TafRa"

Double Disc Centerless Grinding Resin Bond Wheels "TafRa"

TafRa wheels are Products with higher abrasive grain retention compared to exciting products. In Double disc grinding and centerless grinding, where the spontaneous action of abrasive grains is unlikely to occur, The abrasive grains remain for a long time without falling off, so that the sharpness is maintained and the dress interval is extended. As with existing products, it can be applications with WA dresses and X-POWER dresses.
Electroplated Reamer (for one-pass honing)

Electroplated Reamer (for one-pass honing)

High-precision electroplated reamer with micron-level control of tool outer diameter accuracy and good machining accuracy.
Using a machining center that does not require a dedicated machine, high-efficiency is achieved by one-pass processing.

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