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SUNPAX Micro is a series of small-diameter, high-precision tools specialized for machining aluminum alloys. Its high-rigidity design ensures excellent machining stability and dimensional accuracy even during high-feed machining.
To contribute to higher efficiency in precision component machining, we offer the following two types of lineup.

Compared to conventional diamond resin abrasive wheels, this diamond vitrified abrasive wheel offers superior shape retention. It is suitable for difficult-to-machine materials such as cemented carbide molds and SiC molds, as well as for grinding glass materials.

This is a highly porous general-purpose super-finishing wheel utilizing new abrasive grains. It features excellent chip evacuation, making it resistant to clogging, delivering superior cutting performance, and offering extended service life.

We have developed a multi-flute end mill (φ1 to φ3) with all cutting edges made of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. Its key feature is the high number of flutes—25 flutes on the φ3 diameter—despite its small size.

Achieving miniaturization (φ0.3–1.5) of PCD drills essential for high-precision machining of hard and brittle materials like SiC and cemented carbide. The drill tip is entirely constructed of PCD, enabling long-life drilling with reduced chipping. Meeting the next-generation demands for semiconductor-related components, precision mold parts, and more.

Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.

This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.

The newly developed "KD Dresser", added to our lineup, is a rotary dresser that achieves both high-precision overall shape and cutting performance.

CBN electroplated wheel suitable for machining high-precision gross shapes by truing after Electroplated. No adjustment on the machine is required, and Ra 0.8μm or less and shape accuracy of ±0.005mm can be achieved.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).