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Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.

Electroplated wheels are equipped with thread-like irregularities on the outer circumferential surface and are specialized for processing that requires sharpness.

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

Diamond metal wheels for chamfering automobile glass, which play an important role in improving automobile safety.

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

This wheel is used for grinding thin glass used in displays such as TVs, PCs, and smartphones.

In the machining of precision parts and mechanical parts made of ceramics and other materials, the technology of uniformly dispersing abrasive grains in the abrasive grain layer has made it possible to improve sharpness while maintaining a long service life, compared to conventional metal tools.
In addition, the ultra-thin abrasive grain layer reduces machining load and chipping in the machining of hard and brittle materials and other special materials, thereby improving machining efficiency and demonstrating its superiority over other tools.

Bright Star is a superabrasive wheel with a special bond structure that has a high elasticity not found in conventional resin bonds, and is effective for processing that requires luster. BRS2 Bond is a hard type that is effective for processes that require a certain amount of material to be removed, and is compatible with both lapping and grinding. BRS5 bond is a soft type and is effective for polishing processes such as lapping and polishing.

This core drill is used for drilling holes in automotive glass, which plays an important role in improving automobile safety. It is equipped with a seamer section that drills holes and performs chamfering at the same time.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1point) or 2, 3, 4, 8 point cutting edges, depending on the application. Since coolant is not used, treatment facilities are not necessary, and the thin scribe line allows many "chip count" to be obtained. Chipping during breaking is less likely to occur than when using a cutter, and the optimum point shape can be selected.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.