Search by Industry

Compared to conventional diamond resin abrasive wheels, this diamond vitrified abrasive wheel offers superior shape retention. It is suitable for difficult-to-machine materials such as cemented carbide molds and SiC molds, as well as for grinding glass materials.

Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.

Electroplated wheels are equipped with thread-like irregularities on the outer circumferential surface and are specialized for processing that requires sharpness.

SUNCREA contributes to improving processing efficiency and reducing costs in hard and brittle materials such as sapphire, carbide, and ceramics, hard magnetic materials such as ferrite and neodymium iron, and iron-based materials such as sintered parts.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

Diamond metal wheels for chamfering automobile glass, which play an important role in improving automobile safety.

Diamond wheels with varying bonding materials such as curve generating wheels, pallets, lens centering wheels and grinding wheels are used for grrinding camera and binocular lenses, prisms, etc.

This wheel is used for grinding thin glass used in displays such as TVs, PCs, and smartphones.

In the machining of precision parts and mechanical parts made of ceramics and other materials, the technology of uniformly dispersing abrasive grains in the abrasive grain layer has made it possible to improve sharpness while maintaining a long service life, compared to conventional metal tools.
In addition, the ultra-thin abrasive grain layer reduces machining load and chipping in the machining of hard and brittle materials and other special materials, thereby improving machining efficiency and demonstrating its superiority over other tools.

Bright Star is a superabrasive wheel with a special bond structure that has a high elasticity not found in conventional resin bonds, and is effective for processing that requires luster. BRS2 Bond is a hard type that is effective for processes that require a certain amount of material to be removed, and is compatible with both lapping and grinding. BRS5 bond is a soft type and is effective for polishing processes such as lapping and polishing.

This core drill is used for drilling holes in automotive glass, which plays an important role in improving automobile safety. It is equipped with a seamer section that drills holes and performs chamfering at the same time.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1-point) or 2-, 3-, 4-, or 8-point cutting edges, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the narrow scribe line allows a large number of "inserts" to be taken. Chipping during breaking is less likely to occur than when using a cutter, and the optimum "point" shape can be selected.