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AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

The FINE MASTER series is a wheel that uses "BFM bond" for simultaneous grinding that realizes simultaneous grinding of heterogeneous composite materials such as tungsten carbide and steel materials with high efficiency and high precision, and "BFS bond" for mirror finishing, which realizes mirror grinding of tungsten carbide, steel materials, ceramics, etc. with high efficiency and high precision.

TafRa wheels are Products with higher abrasive grain retention compared to exciting products. In Double disc grinding and centerless grinding, where the spontaneous action of abrasive grains is unlikely to occur, The abrasive grains remain for a long time without falling off, so that the sharpness is maintained and the dress interval is extended. As with existing products, it can be applications with WA dresses and X-POWER dresses.

Vitrsoft is a vitrified bond wheel with very good dressability for grinding jigs and molds of HSS and die steel, replacing general firing wheels.CBN Vitrified bond wheel. It can be easily formed by a single point dresser and offers higher efficiency and longer life than general fired wheels (WA).

CBNVitrified bond wheels are manufactured in a variety of sizes, from small-diameter wheels of φ10 mm or less to large-diameter wheels of φ1000 mm, and are widely used in a wide range of applications, including the machining of various automobile parts and the internal grinding of bearings. We also support various applications such as form grinding wheels for angular grinding, centerless wheels, and double-disc wheels with hexagonal pellets.

In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years. We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.

Asahi Diamond produces various types of precision wire drawing dies, such as those applicable to gold and other soft wires used in the manufacture of semiconductors. It also markets various types of drawing dies. Natural diamond, SUNPAX, and synthesized single-crystal diamond are used for wire drawing dies, such as formed dies, guide dies for tin-plated wires, diamond nipples, and others.

Our original coating technologies utilizing the chemical vapor deposition method can be applied on tools with any complicated shape while retraining both high adhesiveness to base metal and excellent wear resistance. With choice of the right type and thickness of coating depending on the application, these tools are most suitable for processing carbon, ceramics, and FRP.

With our processing know-how and a wide selection of diamond/CBN blanks, we offer standard and custom-made products and also special specification (chip breakers, wipers, etc.) designs to improve productivity in processing various materials (aluminum, nonferrous metals, hardened steel, cast iron, sintered metals, etc.

To meet the market demand for higher productivity, we developed helical type drills with a diamond compact to achieve rapid feeding and reduces thrust. Also available are special types that solve exit burr and chip obstruction problems.
They also enable process integration by adopting one-pass finish and multistep edges.

To meet the market demand for higher productivity, we developed helical type drills with a diamond compact to achieve rapid feeding and reduces thrust. Also available are special types that solve exit burr and chip obstruction problems. They also enable process integration by adopting one-pass finish and multistep edges.