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件数：全91件 Results：91 in total

Aluminum Alloy "SUNPAX Micro Drill & Reamer" for Small-Diameter Holes

Aluminum Alloy "SUNPAX Micro Drill & Reamer" for Small-Diameter Holes

SUNPAX Micro is a series of small-diameter, high-precision tools designed specifically for machining aluminum alloys. Its high-rigidity design ensures excellent machining stability and dimensional accuracy, even during high-feed-rate machining.
To help improve the efficiency of precision parts machining, we offer the following two product lines:
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Vitrified Diamond Grinding Wheels for Aspheric Lenses

Vitrified Diamond Grinding Wheels for Aspheric Lenses

Compared to conventional diamond resin-bonded grinding wheels, this diamond vitrified grinding wheel offers superior shape retention and is suitable for grinding difficult-to-machine materials such as cemented carbide and SiC molds, as well as for polishing glass materials.
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"AFF Grinding Wheel" for Superfinishing Bearing Raceways

"AFF Grinding Wheel" for Superfinishing Bearing Raceways

This is a highly porous general-purpose super-finishing wheel that uses a new abrasive grain. Thanks to its excellent chip evacuation properties, it is resistant to clogging, offers superior cutting performance, and has a long service life.
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PCD Multi-Edge End Mills for Machining Hard and Brittle Materials “PCD Multi Edges”

PCD Multi-Edge End Mills for Machining Hard and Brittle Materials “PCD Multi Edges”

We have developed a multi-flute end mill (φ1–φ3) with cutting edges made entirely of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. A key feature of this tool is its high number of flutes—25 in total—despite its small diameter of φ3.
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"Micro PCD Drill" for Drilling Holes in Hard, Brittle Materials

"Micro PCD Drill" for Drilling Holes in Hard, Brittle Materials

We have achieved smaller diameters (φ0.3–1.5) for PCD drills, which are essential for high-precision machining of hard and brittle materials such as SiC and cemented carbide. With the drill tip composed entirely of PCD, these drills offer a long service life and minimize chipping during drilling. They meet the next-generation requirements for semiconductor-related components, precision mold parts, and other applications.
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Diamond wheel for grinding SiC surfaces "M-cloud"

Diamond wheel for grinding SiC surfaces "M-cloud"

These are metal-bonded wheels designed for grinding the surfaces of wafers, including SiC and GaN. Their ultra-porous structure enables fine-grit grinding that was previously impossible with conventional metal-bonded wheels, and they offer superior cutting performance and wear resistance compared to vitrified-bonded wheels of the same grit size.
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Diamond Wire "EcoMEP"

Diamond Wire "EcoMEP"

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.
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Sharpness-oriented electroplated wheel "AG Wheel"

Sharpness-oriented electroplated wheel "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.
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Diamond Wheels for Various Wafer Surface Grinding

Diamond Wheels for Various Wafer Surface Grinding

These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.
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Roller Dresser Specialized for Sharpness “KD Dresser”

Roller Dresser Specialized for Sharpness “KD Dresser”

The newly developed "KD Dresser", added to our lineup, is a rotary dresser that achieves both high-precision overall shape and cutting performance.
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CBN Electroplated Wheels for High-Precision Grinding

CBN Electroplated Wheels for High-Precision Grinding

CBN electroplated wheel suitable for machining high-precision gross shapes by truing after Electroplated. No adjustment on the machine is required, and Ra 0.8μm or less and shape accuracy of ±0.005mm can be achieved.
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Super-Porous Metal Bond Wheels <span wg-1="">"AEROMETAL"</span>

Super-Porous Metal Bond Wheels "AEROMETAL"

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).
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If you have any questions or would like to discuss anything, please feel free to contact us at
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