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SUNPAX Micro Drill & Reamer for Small-Diameter Aluminum Alloy Drilling

SUNPAX Micro is a series of small-diameter, high-precision tools specialized for machining aluminum alloys. Its high-rigidity design ensures excellent machining stability and dimensional accuracy even during high-feed machining.
To contribute to higher efficiency in precision component machining, we offer the following two types of lineup.

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Vitrified diamond grinding wheel for aspheric lenses

Compared to conventional diamond resin abrasive wheels, this diamond vitrified abrasive wheel offers superior shape retention. It is suitable for difficult-to-machine materials such as cemented carbide molds and SiC molds, as well as for grinding glass materials.

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AFF Grinding Wheel for Bearing Raceways

This is a highly porous general-purpose super-finishing wheel utilizing new abrasive grains. It features excellent chip evacuation, making it resistant to clogging, delivering superior cutting performance, and offering extended service life.

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PCD Multi-Edge End Mill for Machining Hard and Brittle Materials

We have developed a multi-flute end mill (φ1 to φ3) with all cutting edges made of PCD. This tool achieves both high precision and long tool life when machining hard and brittle materials such as SiC and cemented carbide, enabling our customers to achieve high-efficiency machining. Its key feature is the high number of flutes—25 flutes on the φ3 diameter—despite its small size.

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Micro PCD Drill for Hard and Brittle Materials

Achieving miniaturization (φ0.3–1.5) of PCD drills essential for high-precision machining of hard and brittle materials like SiC and cemented carbide. The drill tip is entirely constructed of PCD, enabling long-life drilling with reduced chipping. Meeting the next-generation demands for semiconductor-related components, precision mold parts, and more.

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Diamond wheel for grinding SiC surfaces "M-cloud"

Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.

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Diamond Wire "EcoMEP"

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.

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Sharpness-oriented electroplated wheel "AG Wheel"

AG(Array Grain) wheel.
The outstanding sharpness prevents clogging and burn mark, and the service life is more than twice as long as that of conventional Electroplated. It can be used for profile type and is effective in a wide range of machining operations from roughing to finishing.

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Diamond Wheels for Various Wafer Surface Grinding

This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.

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Roller Dresser Specialized for Sharpness “KD Dresser”

The newly developed "KD Dresser", added to our lineup, is a rotary dresser that achieves both high-precision overall shape and cutting performance.

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CBN Electroplated Wheels for High-Precision Grinding

CBN electroplated wheel suitable for machining high-precision gross shapes by truing after Electroplated. No adjustment on the machine is required, and Ra 0.8μm or less and shape accuracy of ±0.005mm can be achieved.

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Super-Porous Metal Bond Wheels <span wg-1="">"AEROMETAL"</span>

Super-Porous Metal Bond Wheels "AEROMETAL"

Features
1) Good chip evacuation
(2) Stable grindability
(3) Excellent wear resistance and long life
(4) Truing with Electroplated truer is possible (limited to CBN ).

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Refinement

SUNPAX Micro Drill & Reamer for Small-Diameter Aluminum Alloy Drilling

Vitrified diamond grinding wheel for aspheric lenses

AFF Grinding Wheel for Bearing Raceways

PCD Multi-Edge End Mill for Machining Hard and Brittle Materials

Micro PCD Drill for Hard and Brittle Materials

Diamond wheel for grinding SiC surfaces "M-cloud"

Diamond Wire "EcoMEP"

Sharpness-oriented electroplated wheel "AG Wheel"

Diamond Wheels for Various Wafer Surface Grinding

Roller Dresser Specialized for Sharpness “KD Dresser”

CBN Electroplated Wheels for High-Precision Grinding

Super-Porous Metal Bond Wheels "AEROMETAL"

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