Diamond Wheels for Various Wafer Surface Grinding
Diamond Grinding Wheels for Chamfering
- Business Division
- Electronics & Semiconductor
- Types of Tools
- Grinding Tools
- Processing Methods
- Grinding
- Work
- Semiconductor materials, Glass, Ceramics
- Bond
- Metal
Product Overview
A highly porous wheel that combines sharpness and wear resistance
These are metal-bonded wheels designed for grinding the surfaces of wafers, including SiC and GaN. Their ultra-porous structure enables fine-grit grinding that was previously impossible with conventional metal-bonded wheels, and they offer superior cutting performance and wear resistance compared to vitrified-bonded wheels of the same grit size.
Application
- Grinding of Various Substrate Materials (SiC, GaN, Sapphire, Glass, etc.)
Types of Adhesives
- Metal
Product Features
Thanks to its unprecedented, ultra-porous structure, we have achieved the use of fine grain sizes—a breakthrough that redefines the concept of metal-bonded abrasives. This distinctive structure prevents clogging, resulting in a wheel that offers cutting performance equivalent to that of vitrified-bonded wheels, along with superior wear resistance. It demonstrates particularly excellent machining performance for SiC grinding.
Related products