Diamond Wheels for Various Wafer Surface Grinding
Diamond Grinding Wheels for Chamfering
- Business Units
- Electronics & Semiconductor
- Types of tools
- Grinding Tools
- Processing method
- Grinding
- Work
- Semiconductor materials, Glass, Ceramics
- Bond
- Metal
Product Details
Super porous wheel that combines sharpness and wear resistance
Metal bond wheels for surface grinding of wafers such as SiC and GaN. The ultra-porous structure realizes fine grain grinding, which could not be applied with conventional metal bond wheels, and has excellent sharpness and wear resistance compared to vitrified bond wheels of the same particle size.
Application
- Grinding of various substrate materials (SiC, GaN, sapphire, glass, etc.)
Bond Type
- Metal
Product characteristics
The unprecedented super-porous structure has realized the application of fine grain size that overturns the concept of metal bond. The characteristic structure suppresses clogging, and the wheel is characterized by sharpness and high wear resistance comparable to those of vitrified bond, and exhibits excellent machining characteristics, especially in grinding SiC.
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