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Our original coating technologies utilizing the chemical vapor deposition method can be applied on tools with any complicated shape while retraining both high adhesiveness to base metal and excellent wear resistance. With choice of the right type and thickness of coating depending on the application, these tools are most suitable for processing carbon, ceramics, and FRP.

To meet the market demand for higher productivity, we developed helical type drills with a diamond compact to achieve rapid feeding and reduces thrust. Also available are special types that solve exit burr and chip obstruction problems. They also enable process integration by adopting one-pass finish and multistep edges.

[Endmill]
Purposely designed edges to cater for your needs to improve the efficiency of various types of processing such as milling, grooving, spot facing, and curve facing. Also available are spiral types for high-speed cutting, high-precision ball shapes, and taps. Applications include high-precision and high-efficiency processing of metal molds, compressors, FRP, acrylic, etc.
[Routers & Tipped Saw]
They allow you to cut costs because they produce a long lasting surface finish in cutting, grooving, and boring of wood, building materials, printed-circuit boards, artificial marble, plastics, etc. and have a long life, Also, we meet a wide range of demands such as whole form processing by combining them.

By integrating the tooling holder and reamer into a single unit, tool length can be shortened and rigidity can be increased to meet high precision requirements. Also, we can be manufactured in accordance with various holder standards.

With stable quality based on control of outer diameter dimension and runout accuracy, which are the key elements of reamers, we can design for high precision requirements such as machined surface roughness, roundness, and coaxiality, as well as high-speed feed. We have a large lineup of products, from standard specifications to value-added specifications, to meet our customers' needs.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1-point) or 2-, 3-, 4-, or 8-point cutting edges, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the narrow scribe line allows a large number of "inserts" to be taken. Chipping during breaking is less likely to occur than when using a cutter, and the optimum "point" shape can be selected.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

Core drill with excellent accuracy and sharpness, suitable for various work materials such as LED substrate materials, semiconductor materials such as sapphire, ceramics, etc.

These blades are used in the forming process (squaring) of monocrystalline silicon ingots for solar cells and in the process of removing the impurity layer (cropping) of polycrystalline silicon ingots for solar cells. There are three types of blades: a standard type with a good balance between sharpness and long life, a slit type that prioritizes processing efficiency and sharpness, and a wave type with special specifications aimed at reducing chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.