Browse by Industry

Our original coating technologies utilizing the chemical vapor deposition method can be applied on tools with any complicated shape while retraining both high adhesiveness to base metal and excellent wear resistance. With choice of the right type and thickness of coating depending on the application, these tools are most suitable for processing carbon, ceramics, and FRP.

To meet the market demand for higher productivity, we developed helical type drills with a diamond compact to achieve rapid feeding and reduces thrust. Also available are special types that solve exit burr and chip obstruction problems. They also enable process integration by adopting one-pass finish and multistep edges.

[Endmill]
Purposely designed edges to cater for your needs to improve the efficiency of various types of processing such as milling, grooving, spot facing, and curve facing. Also available are spiral types for high-speed cutting, high-precision ball shapes, and taps. Applications include high-precision and high-efficiency processing of metal molds, compressors, FRP, acrylic, etc.
[Routers & Tipped Saw]
They allow you to cut costs because they produce a long lasting surface finish in cutting, grooving, and boring of wood, building materials, printed-circuit boards, artificial marble, plastics, etc. and have a long life, Also, we meet a wide range of demands such as whole form processing by combining them.

By integrating the tooling holder and reamer into a single unit, tool length can be shortened and rigidity can be increased to meet high precision requirements. Also, we can be manufactured in accordance with various holder standards.

With a focus on consistent quality based on the control of key reamer specifications—such as outer diameter and runout tolerance—our designs can accommodate high-precision requirements, including surface roughness, roundness, and concentricity, as well as high-speed feed rates. We meet our customers’ needs with a wide range of products, from standard specifications to value-added options.

These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

This core drill offers superior precision and cutting performance. It is suitable for a wide range of materials, including LED substrates, semiconductor materials such as sapphire, and ceramics.

These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.