Abrasive Grain Uniform Dispersion Metal Wheel "SOLOTEL"

Product Details

Ultra thin-blade type core drill with uniformly dispersed abrasive grains

In the machining of precision parts and mechanical parts made of ceramics and other materials, the technology of uniformly dispersing abrasive grains in the abrasive grain layer has made it possible to improve sharpness while maintaining a long service life, compared to conventional metal tools.
In addition, the ultra-thin abrasive grain layer reduces machining load and chipping in the machining of hard and brittle materials and other special materials, thereby improving machining efficiency and demonstrating its superiority over other tools.

Application

• Grinding and coring of various ceramics, sapphire, quartz glass, GaN, silicon, MMC and other hard and brittle materials

Bond Type

• Metal

Product characteristics

Uniform dispersion of abrasive grains provides longer life, better sharpness, and less chipping than conventional metal wheels.
Can be used for various machining methods such as core punching, counterboring, and drilling.

Manufacturable range	Target Work
Grain size: #30~#400~ (*#1000) *Please contact us for production of finer grain size than #1000.	Various ceramic materials (silicon nitride, SiC, zirconia, etc.)
Outer diameter: φ1.0~φ100	Semiconductor materials (GaN, sapphire, glass, etc.)
Blade thickness: 0.3mm~.	Others (MMC, metallic materials, CFRP, etc.)

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Processing example: Counterbored processing of polycrystalline SiC

SOLOTEL® has good shape at workpiece corners and can suppress surface chipping

	Machining Examples*.	Tool wear*.	Angle R [mm]	Chipping [μm]
Conventional metal: #100 - blade thickness 1.0mmT	100	100	0.36	74
Solotel®: #100 - blade thickness 0.5mmT	50	30	0.14	45
Solotel®: #140 - blade thickness 0.5mmT	45	55	0.08	32

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*Relative value when the load when processing with conventional metal is 100

Measuring point

Conventional metal #100 - blade thickness 1.0mmT	SOLOTEL® #100 - blade thickness 0.5mmT	SOLOTEL® #140 - blade thickness 0.5mmT

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Comparison with conventional metal

conventional metal	SOLOTEL®.

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Example of thin-blade SOLOTEL®.

#140 thin-blade specification	#40 thin-blade specification

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Tool Shape Applications

Core Drill Shape
coreless
counter sink (e.g. so screw-heads don't protrude above surface)

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Small diameter non-core shape
Drilling (contouring, helical, etc.)

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Si wafer trimming (outer edge stepping) process

Chipping size is proportional to grain size
Chipping was less than 70 μm at #400.


Tool specifications: Outer diameter φ10 - Blade thickness 0.5mmT
Workpiece: Si Wafer

Trimming

Grit size	Processing load*.	Chipping [μm]
#140	100	180
#200	100	96
#400	120	67
#800	150	44

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*#140 - Relative value when the load is 100 when processed with SOLOTEL®.

chipping state