- Business Units
- Electronics & Semiconductor
- Types of tools
- Grinding Tools
- Processing method
- Grinding
- Work
- Semiconductor Materials
- Bond
- Metal, Resin
Product Details
Diamond metal wheels and diamond resin wheels are used for grinding silicon ingots for solar cells and semiconductors. Based on our experience in various fields, we offer wheels that meet the needs of our customers and the machines they own.
Application
- Edge grinding on the outer of wafer, rough and finish grinding
Bond Type
- Resin
- Metal
Product characteristics
Main specifications for peripheral grinding and orientation flat processing
Metal bond | Rough grinding / Fine grinding | Outer diameter |
|---|---|---|
MK10 | #60~80 / #140~200 | φ78 ~ φ120 |
The above are general specifications for silicon ingot processing. Other specifications are also available upon consultation.
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