- Business Division
- Electronics & Semiconductor
- Types of Tools
- Grinding Tools
- Processing Methods
- Grinding
- Work
- Semiconductor Materials
- Bond
- Metal, Resin
Product Overview
Diamond metal wheels and diamond resin wheels are used for grinding silicon ingots for solar cells and semiconductors. Drawing on our proven track record across various industries, we provide wheels tailored to our customers’ needs and the machinery they use.
Application
- Edge grinding on the outer of wafer, rough and finish grinding
Types of Adhesives
- Resin
- Metal
Product Features
Main specifications for peripheral grinding and orientation flat processing
Metal bond | Rough grinding / Fine grinding | Outer diameter |
|---|---|---|
MK10 | #60~80 / #140~200 | φ78 ~ φ120 |
The above are general specifications for silicon ingot processing. Other specifications are also available upon consultation.
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