Diamond Grinding Wheels for Chamfering

Product Details

High performance wafer edge grinding wheel with shape retention and high sharpness and long life

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of silicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. We are able to provide a wide variety of specifications, including single grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Application

• Edge grinding on the outer of wafer, rough and finish grinding

Bond Type

• Metal
• Resin

Product characteristics

The table of sizes

Process	Bond	Grit size	Wheel diameter	Recommended grindin condition Peripheral Speed	Recommended grinding condition Feed Speed
1st Rough grinding	Metal	#800	Φ102, Φ202	~85m/sec (~5,100m/min)	15~35mm/sec
2nd Fine grinding	Metal/ Resin	#1500~#3000	Φ202/ Φ50	~95m/sec (~5,700m/min)	8~24mm/sec

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Share of the diamond layer
(R type) (T type)