- Business Units
- Electronics & Semiconductor
- Types of tools
- Grinding Tools
- Processing method
- Grinding
- Work
- Semiconductor materials, Nonferrous and specialty metals, Composite materials and resins
- Bond
- Electroplated
Product Details
High-quality, high-reliability pad conditioners to meet diverse needs
In the manufacturing process of semiconductor devices and wafers, the demand for planarization is increasing year by year as wiring becomes finer and more multilayered. In the CMP process, which is used as a planarization technology, the conditioning of polishing pads plays an important role in stabilizing polishing characteristics, and we have been providing high-quality, highly reliable conditioners for over 25 years.We continue to contribute to the stabilization of the CMP process, offering conditioners in a variety of shapes and specifications to meet diverse needs.
Application
- Conditioning of polishing pads
Bond Type
- Electroplated
Product characteristics
Related products