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Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.

These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.