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This grinding wheel is used for polishing as a final finishing step for metal products. It is ideal for superfinishing the raceways of various bearings and for superfinishing the outer diameters of needle bearings, roller bearings, and similar components.

These grinding wheels are designed for the final finishing of bearings. We will select the grinding wheel best suited for the raceways of various types of bearings.
These grinding wheels are highly regarded for the ultra-precision grinding of bearing raceways. CBN, we offer a wide lineup that includes CBD grinding wheels designed for superior cutting performance and DBN grinding wheels designed for superior surface finish accuracy, enabling us to design grinding wheels tailored to your specific needs.

These are grinding wheels designed for precision grinding of bearings, automotive parts, home appliance parts, and other precision mechanical components. We manufacture vitrified-bonded grinding wheels—ideal for precision grinding—using our proprietary manufacturing process.

With our processing know-how and a wide selection of diamond/CBN blanks, we offer standard and custom-made products and also special specification (chip breakers, wipers, etc.) designs to improve productivity in processing various materials (aluminum, nonferrous metals, hardened steel, cast iron, sintered metals, etc.

"SUNBRIGHT" is a monocrystalline diamond cutting tool for ultra-precision cutting.
The sharp cutting edges and nano-order level contouring accuracy have been established through high-precision machining technology.
It can be used for various lens products, lens molds, and mirror finishing of non-ferrous metal products.

These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

This core drill offers superior precision and cutting performance. It is suitable for a wide range of materials, including LED substrates, semiconductor materials such as sapphire, and ceramics.

These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

The tooling requirements of advanced processes, such as internal grinding, cylindrical grinding, centerless grinding, double-disc surface grinding, thread-grinding and cutting of ferrites, samarium cobalt, neodymium iron and other magnetic materials, vary widely. Asahi Diamond's overall technological capabilities, and its expertise in bond selection in particular, has enabled it to keep pace with the quickly evolving needs of its customers.

(1) Diamond wheel for centerless grinding 
(2) Metal bond wheels for double-disc surface grinding
(3) Metal bond wheels for grinding rotary transformer cores 
(4) Electroplated formed diamond wheels for grinding magnetic materials