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Grinding wheels for final finishing of metal products. Suitable for super-finishing of raceway surfaces of various bearings and for super-finishing of outer diameters of needles, rollers, etc.

Grinding wheels are used for the final finishing of bearings. We select the most suitable grinding wheel for various bearing raceways.
They are highly evaluated for polishing ultra-precision parts for super-finishing of bearing raceways. In addition to standard CBN wheels, we offer a broad lineup of CBD wheels, which emphasize sharpness, and DBN wheels, which emphasize surface finish accuracy, allowing us to design wheels that meet your needs.

Grinding wheels for precision grinding of bearings, automotive parts, home appliance parts, and other precision machine parts. We manufacture vitrified bond grinding wheels, which are ideal for precision grinding, using our own unique manufacturing process.

With our processing know-how and a wide selection of diamond/CBN blanks, we offer standard and custom-made products and also special specification (chip breakers, wipers, etc.) designs to improve productivity in processing various materials (aluminum, nonferrous metals, hardened steel, cast iron, sintered metals, etc.

"SUNBRIGHT" is a monocrystalline diamond cutting tool for ultra-precision cutting.
The sharp cutting edges and nano-order level contouring accuracy have been established through high-precision machining technology.
It can be used for various lens products, lens molds, and mirror finishing of non-ferrous metal products.

This tool is used for cutting hard and brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. There are also types in which rough diamonds are processed into a conical shape (1-point) or 2-, 3-, 4-, or 8-point cutting edges, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the narrow scribe line allows a large number of "inserts" to be taken. Chipping during breaking is less likely to occur than when using a cutter, and the optimum "point" shape can be selected.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

Core drill with excellent accuracy and sharpness, suitable for various work materials such as LED substrate materials, semiconductor materials such as sapphire, ceramics, etc.

These blades are used in the forming process (squaring) of monocrystalline silicon ingots for solar cells and in the process of removing the impurity layer (cropping) of polycrystalline silicon ingots for solar cells. There are three types of blades: a standard type with a good balance between sharpness and long life, a slit type that prioritizes processing efficiency and sharpness, and a wave type with special specifications aimed at reducing chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

The tooling requirements of advanced processes, such as internal grinding, cylindrical grinding, centerless grinding, double-disc surface grinding, thread-grinding and cutting of ferrites, samarium cobalt, neodymium iron and other magnetic materials, vary widely. Asahi Diamond's overall technological capabilities, and its expertise in bond selection in particular, has enabled it to keep pace with the quickly evolving needs of its customers.

(1) Diamond wheel for centerless grinding 
(2) Metal bond wheels for double-disc surface grinding
(3) Metal bond wheels for grinding rotary transformer cores 
(4) Electroplated formed diamond wheels for grinding magnetic materials