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"Micro PCD Drill" for Drilling Holes in Hard, Brittle Materials

Business Division
Electronics & Semiconductor
Types of Tools
Cutting Tools
Processing Methods
Drilling
Work
Semiconductor materials, precision mold materials

Product Overview

We have achieved smaller diameters (φ0.3–1.5) for PCD drills, which are essential for high-precision machining of hard and brittle materials such as SiC and cemented carbide. With the drill tip composed entirely of PCD, these drills offer a long service life and minimize chipping during drilling. They meet the next-generation requirements for semiconductor-related components, precision mold parts, and other applications.

Application

  • Small-Diameter Drilling in Brittle Materials

Product Features

Its unique tip design enables drilling with a long service life and reduced chipping.

◇Standard Specifications

Cutting Edge Diameter (φ)
DC
Groove Length (mm)
LCF
Overall Length (mm)Tip (mm)
PL
Shank Diameter (φ)
, DCON
0.36.5380.123.0
0.46.538 0.183.0
0.56.5380.233.0
0.6 6.5380.273.0
0.76.5380.293.0
0.86.5380.343.0
0.9 6.5380.403.0
1.0 6.5380.493.0
1.16.5380.563.0
1.26.5380.603.0
1.36.5380.663.0
1.46.5380.733.0
1.56.5380.803.0
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◇Performance Overview: “φ0.45 Machining Data”

Target Materials: SiC ceramics, quartz glass, etc.


Materials

, SiC

Quartz glass
1st hole
In process
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Service Life Comparison (SiC Machining)

If you have any questions or would like to discuss anything, please feel free to contact us at
.