Resin

The FINE MASTER series is a wheel that uses "BFM bond" for simultaneous grinding that realizes simultaneous grinding of heterogeneous composite materials such as tungsten carbide and steel materials with high efficiency and high precision, and "BFS bond" for mirror finishing, which realizes mirror grinding of tungsten carbide, steel materials, ceramics, etc. with high efficiency and high precision.

TafRa wheels are Products with higher abrasive grain retention compared to exciting products. In Double disc grinding and centerless grinding, where the spontaneous action of abrasive grains is unlikely to occur, The abrasive grains remain for a long time without falling off, so that the sharpness is maintained and the dress interval is extended. As with existing products, it can be applications with WA dresses and X-POWER dresses.

Small-diameter formed wheels are used to finish the notches of large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and realize a favorable wafer circumference. As with our edge grinding wheels, we are able to provide a wide variety of specifications, including single-grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of silicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance. We are able to provide a wide variety of specifications, including single grooved wheels, multi-grooved wheels, and wheels for both rough and finish grinding.

Diamond metal wheels and diamond resin wheels are used for grinding silicon ingots for solar cells and semiconductors. Based on our experience in various fields, we offer wheels that meet the needs of our customers and the machines they own.

Modern furniture and building materials use a wide range of materials, from natural wood to cementitious building materials. Superalloys, ultrafine particle tungsten carbides, cermets, special thermal-sprayed metals, and "SUNPAX", are used for cutting tools to process such materials. Diamond wheels are used to shape and grind those tools, and a wide range of grinding capabilities are required. Asahi Diamond offers the most suitable bond system for each type of material, from chip saws to planer blades.

Bright Star is a superabrasive wheel with a special bond structure that has a high elasticity not found in conventional resin bonds, and is effective for processing that requires luster. BRS2 Bond is a hard type that is effective for processes that require a certain amount of material to be removed, and is compatible with both lapping and grinding. BRS5 bond is a soft type and is effective for polishing processes such as lapping and polishing.

NEO STAR wheels are bonded with polyimide resin, which has excellent heat resistance, tensile strength, and elasticity. It can be used for grinding that requires long-time shape retention, heavy-duty grinding, creep-feed grinding, efficient grinding of high-hardness steel (HRC67 higher), and grinding of relatively low-hardness steel (HRC40-50 ) that requires long life.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 µm. The resin bond is often used for cutting various PKGs such as glass, ceramics, and QFNs, where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

"CREEPSTAR" for heavy grinding of tungsten carbide
"POLASTAR POLYX" for heavy grinding of tungsten
"ASPIRE METAL" for heavy grinding of tungsten carbide
SUN Athlete Series
"SUPREMO" High-performance metal wheel for Flute grinding of Carbide tools

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.