Cutter with Steel Core
Diamond Wheels for Various Wafer Surface Grinding
- Business Units
- Electronics & Semiconductor
- Types of tools
- Precision Cutting Tools
- Processing method
- Cutting and Grooving
- Work
- Semiconductor materials, Glass, Ceramics, Precision mold materials, Nonferrous and specialty metals, Ferrous materials, Magnetic materials, Composite materials and Resins
- Bond
- Electroplated, Metal, Resin
Product Details
Dicing blades capable of cutting various work materials with high precision
Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.
Application
- Dicing of semiconductor silicon and compound wafers
- Dicing of various PKGs
- Dicing of various electronic components
Bond Type
- Electroplated
- Metal
- Resin
Product characteristics
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