Cutter with Steel Core
Diamond Wheels for Various Wafer Surface Grinding
- Business Division
- Electronics & Semiconductor
- Types of Tools
- Precision Cutting Tools
- Processing Methods
- Cutting and Grooving
- Work
- Semiconductor materials, Glass, Ceramics, Precision mold materials, Nonferrous and specialty metals, Ferrous materials, Magnetic materials, Composite materials and Resins
- Bond
- Electroplated, Metal, Resin
Product Overview
A dicing blade capable of cutting a wide variety of workpiece materials with high precision
Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.
Application
- Dicing of Semiconductor Silicon and Compound Wafers
- Dicing of Various PKG Types
- Dicing of Various Electronic Components
Types of Adhesives
- Electroplated
- Metal
- Resin
Product Features
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