Tool Grinding with Dry Condition "Power Dry Series"
High-performance wheels for dry grinding of tungsten carbide and high-speed steel. We have diamond resin bond wheels "Power Dry BPD Bond" with excellent sharpness and long life for dry grinding of tungsten carbide, and CBN resin bond wheels "Power Dry II BCD Bond" with excellent sharpness and long life for dry grinding of high speed steel.
Diamond Wheels for Various Wafer Surface Grinding
These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.