Tool Grinding with Dry Condition "Power Dry Series"
High-performance wheels for dry grinding of tungsten carbide and high-speed steel. We have diamond resin bond wheels "Power Dry BPD Bond" with excellent sharpness and long life for dry grinding of tungsten carbide, and CBN resin bond wheels "Power Dry II BCD Bond" with excellent sharpness and long life for dry grinding of high speed steel.
Diamond Wheels for Various Wafer Surface Grinding
This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.