Diamond Wheels for Various Wafer Surface Grinding
Diamond Grinding Wheels for Chamfering
- Business Division
- Electronics, Semiconductors, Transportation
- Types of Tools
- Precision Cutting Tools
- Processing Methods
- Cutting and Grooving
- Work
- Semiconductor Materials
- Bond
- Electroplated
Product Overview
Capable of cutting difficult-to-machine materials
EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.
Application
- Slicing of Hard and Brittle Materials Such as Silicon and SiC
Types of Adhesives
- Electroplated
Product Features
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