Dicing Blade
Diamond wheel for grinding SiC surfaces "M-cloud"
- Business Division
- Electronics & Semiconductor
- Types of Tools
- Grinding Tools
- Processing Methods
- Grinding
- Work
- Semiconductor materials, Glass, Ceramics
- Bond
- Metal, Vitrified, Resin
Product Overview
These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.
Application
- Silicon semiconductor wafer
- Compound Semiconductor Wafers
- Wide-bandgap semiconductor wafers (SiC/GaN)
- SAW Filter Wafers (LT/LN)
- Sapphire/Glass Wafers
- Package Resins (WLP, etc.)
- Ceramic wafers (Al₂O₃/AlN, etc.)
Types of Adhesives
- Vitrified
- Resin
- Metal
Product Features
Features
Provide various wheels for each applications
Modify wheel specifications upon request of customers
Product Lineup
Resin Wheels
Recommended for Silicon Wafer, Heat sink substrate, and Encapsulation materials
Vitrified wheels
Recommended for almost all "electronic components and semiconductor's substrates and materials
Metal wheel
Recommended for Support substrate, Heat sink substrate, Sapphire, and Encapsulation materials
Target Work
- Semiconductor substrate materials
- Silicon
Silicon Carbide
Gallium Nitride
Gallium Oxide
Sapphire
Indium Phosphide
Other Compound Semiconductors - Electronic component materials
- Lithium Tantalate
Lithium Niobate - Encapsulation materials
- Epoxy Molding Compounds
Polyimide Resin
EMC and Copper electrode - Support substrate
- Borosilicate Glass
Non-alkali Glass
Quartz Glass
Other glass - Heat sink substrate
- Sintered Aluminum Nitride
Sintered Silicon Nitride
Sintered Silicon Carbide
Sintered Alumina Oxide
Other Ceramics
We will also propose the most suitable specifications based on your other requests.
Case Studies on Machining High-Gauge Vitri Wheels
Comparison of Surface Roughness and Damage Depth After High-Grit Wheel Grinding of Various Semiconductor Substrate Materials
| Work material | Mesh size | Types of Adhesives | Surface Roughness | Damage Depth |
|---|---|---|---|---|
| Φ12-inch-Si | #30000 | Vitrified | 1–2 nm | ≤100 nm |
| Φ6-inch-LT | #8000 | Vitrified | 3–5 nm | ≤250 nm |
| Φ6-inch-LN | #8000 | Vitrified | 2–4 nm | ≤350 nm |
| Φ6-inch SiC | #30000 | Vitrified | ≤1 nm | ≤100 nm |
| Φ2-inch GaN | #30000 | Vitrified | ≤1 nm | ≤450 nm |
Other Processing Examples
EMC and Cu
No drag, etc. even with high Cu occupancy.
Less step difference between EMC and Cu.
Related products