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These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.

These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.