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These blades are used in the forming process (squaring) of monocrystalline silicon ingots for solar cells and in the process of removing the impurity layer (cropping) of polycrystalline silicon ingots for solar cells. There are three types of blades: a standard type with a good balance between sharpness and long life, a slit type that prioritizes processing efficiency and sharpness, and a wave type with special specifications aimed at reducing chipping on the cut surface.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.

This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.