Metal

This core drill is used for drilling holes in automotive glass, which plays an important role in improving automobile safety. It is equipped with a seamer section that drills holes and performs chamfering at the same time.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades are available in "hub type" and "ring type." The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The hub type is mainly used for dicing silicon and compound wafers for semiconductors. The aluminum base and nickel diamond layer are combined into a single unit, making it easy to handle. The ring type can be used for a wide range of cutting and grooving of various PKG and electronic component materials in addition to semiconductor silicon and compound wafers. Three types of bond can be selected: electroformed, metal, and resin. The electroformed bond can produce an ultra-thin blade with a thickness of 15 μm. The resin bond is often used for cutting glass, ceramics, QFN, and other PKGs where chipping and cutting resistance must be suppressed. Metal bond can be selected from a wide range of bond lineups, from high rigidity types comparable to electroforming to types with excellent cutting performance, to suit various work materials.

Core drill with excellent accuracy and sharpness, suitable for various work materials such as LED substrate materials, semiconductor materials such as sapphire, ceramics, etc.

These blades are used in the forming process (squaring) of monocrystalline silicon ingots for solar cells and in the process of removing the impurity layer (cropping) of polycrystalline silicon ingots for solar cells. There are three types of blades: a standard type with a good balance between sharpness and long life, a slit type that prioritizes processing efficiency and sharpness, and a wave type with special specifications aimed at reducing chipping on the cut surface.

These cutters were developed with an emphasis on safety for use with hand-held machines, and can be used for a variety of work materials. The product lineup includes "Blue" for stone, "New Gold" and "Green" for concrete, "Econo-ARIX" for engine cutters, and many others.

"CREEPSTAR" for heavy grinding of tungsten carbide
"POLASTAR POLYX" for heavy grinding of tungsten
"ASPIRE METAL" for heavy grinding of tungsten carbide
SUN Athlete Series
"SUPREMO" High-performance metal wheel for Flute grinding of Carbide tools

Blades for cutting various materials such as stone, refractory brick, and building materials. We select blades with excellent sharpness, long life, and processing accuracy according to the cutting machine and conditions. Sizes from 8" to 72" can be manufactured, and a quiet type of core is also available. "S-Cut" and "Prime Saw" are available in stock for stone materials, which are in high demand.

This is a diamond wheel for surface grinding of various wafers such as semiconductor materials and electronic device materials. We provide the most suitable wheels for each material. It minimizes machining damage, improves machining efficiency, and contributes to the reduction of machining costs. It can be customized according to the customer's needs.