Electroplated

There are two types of dicing blades: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It consists of an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type is,Various PKGsIt can be used for a wide range of cutting and grooving applications, including electronic component materials. You can choose from three types of bonds: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades as thin as 15 μm.Resin-bonded blades are widely used for cutting glass, ceramics, and various packaged components (such as QFNs) where chipping and cutting resistance must be minimized. For metal-bonded blades, you can select the bond best suited for each workpiece from a wide range of options—from high-rigidity types comparable to electroformed blades to types that offer superior cutting performance.

AA Diamond Technology Co., Ltd. manufactures hub-type dicing blades and provides high-quality products that meet a wide range of cutting needs.
Please visit the official website for more details.
https://www.aa-diatech.com/jp/

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

The tooling requirements of advanced processes, such as internal grinding, cylindrical grinding, centerless grinding, double-disc surface grinding, thread-grinding and cutting of ferrites, samarium cobalt, neodymium iron and other magnetic materials, vary widely. Asahi Diamond's overall technological capabilities, and its expertise in bond selection in particular, has enabled it to keep pace with the quickly evolving needs of its customers.

(1) Diamond wheel for centerless grinding 
(2) Metal bond wheels for double-disc surface grinding
(3) Metal bond wheels for grinding rotary transformer cores 
(4) Electroplated formed diamond wheels for grinding magnetic materials

EcoMEP diamond wire is a thin elongated wire with diamond abrasives electroplated onto high tensile wire using special technology. Compared to the conventional loose-abrasive method, the slicing (processing) time of rigid and fragile materials such as silicon and sapphire can be shortened. It is also possible to reduce cutting margins and processing strains, so improvement of yield can be expected. Because water-soluble coolant can be used, dust can be collected and recycled, making this an eco-friendly product that also reduces overall costs. Clients can try out our cutting machines at our testing laboratory, which enables us to offer machines and cutting conditions that are best-suited to the materials our clients need to cut.