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This is a core drill designed for drilling holes in automotive glass, which plays a crucial role in improving vehicle safety. It features a chamfering section that performs chamfering simultaneously with drilling, helping to streamline the manufacturing process.

These tools are used for cutting hard, brittle materials such as compound semiconductors (gallium arsenide, gallium phosphide, indium phosphide) and sapphire. Some types feature rough diamond that has been machined into a conical shape (1-point) or into cutting edges with 2, 3, 4, or 8 points, depending on the application. Since no grinding fluid is used, no processing facilities are required, and the fine scribing line allows for a high number of “chips” to be obtained.Compared to standard cutters, chipping during breaking is minimized, and you can select the optimal “point” shape.

Cutters with a metal base are available in "multi-cutters" and "single-blade types. Multi-cutters can cut and groove by combining multiple cutters with specifications suitable for the work material. Our unique technologies such as cutting edge shape, pitch accuracy, and accumulation accuracy realize high machining quality. The single-blade type is a cutter with a diamond or CBN abrasive grain layer formed on the periphery of the steel steel core. Electroplated, metal, or resin can be selected for the bond, and the cutting edge shape (V-shape, R-shape) and steel core shape (all relief, under-neck relief) can also be selected according to requirements.

Dicing blades come in two types: “hub type” and “ring type.” The hub type is primarily used for dicing semiconductor silicon and compound wafers. It features an aluminum base and a nickel-bonded diamond layer integrated into a single unit, making it easy to handle. The ring type can be used for a wide range of applications, including cutting and grooving not only semiconductor silicon and compound wafers but also various packaging materials and electronic component materials.There are three types of bonds to choose from: electroformed, metal, and resin. The electroformed bond allows for the production of ultra-thin blades with a thickness of 15 μm.Resin bonds are frequently used for cutting glass, ceramics, and various packages such as QFNs, where chipping and cutting resistance must be minimized. Metal bonds offer a wide range of options—from high-rigidity types comparable to electroformed bonds to types with superior cutting performance—allowing you to select the bond best suited for your specific workpiece material.

This core drill offers superior precision and cutting performance. It is suitable for a wide range of materials, including LED substrates, semiconductor materials such as sapphire, and ceramics.

These blades are used in the shaping process (squaring) of monocrystalline silicon ingots for solar cells and in the process (cropping) of removing impurity layers from polycrystalline silicon ingots for solar cells. There are three types: the standard “Normal” type, which offers a balance between cutting performance and service life; the “Slit” type, designed to prioritize processing efficiency and cutting performance; and the “Wave” type, a special specification designed to reduce chipping on the cut surface.

These cutters were developed with an emphasis on safety for use with hand-held machines, and can be used for a variety of work materials. The product lineup includes "Blue" for stone, "New Gold" and "Green" for concrete, "Econo-ARIX" for engine cutters, and many others.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

"CREEPSTAR" for heavy grinding of tungsten carbide
"POLASTAR POLYX" for heavy grinding of tungsten
"ASPIRE METAL" for heavy grinding of tungsten carbide
SUN Athlete Series
"SUPREMO" High-performance metal wheel for Flute grinding of Carbide tools

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.

Blades for cutting various materials such as stone, refractory brick, and building materials. We select blades with excellent sharpness, long life, and processing accuracy according to the cutting machine and conditions. Sizes from 8" to 72" can be manufactured, and a quiet type of core is also available. "S-Cut" and "Prime Saw" are available in stock for stone materials, which are in high demand.

High-performance wheels for dry grinding of tungsten carbide and high-speed steel. We have diamond resin bond wheels "Power Dry BPD Bond" with excellent sharpness and long life for dry grinding of tungsten carbide, and CBN resin bond wheels "Power Dry II BCD Bond" with excellent sharpness and long life for dry grinding of high speed steel.