Diamond Wheels for Grinding Magnetic Materials
The tooling requirements of advanced processes, such as internal grinding, cylindrical grinding, centerless grinding, double-disc surface grinding, thread-grinding and cutting of ferrites, samarium cobalt, neodymium iron and other magnetic materials, vary widely. Asahi Diamond's overall technological capabilities, and its expertise in bond selection in particular, has enabled it to keep pace with the quickly evolving needs of its customers.
(1) Diamond wheel for centerless grinding
(2) Metal bond wheels for double-disc surface grinding
(3) Metal bond wheels for grinding rotary transformer cores
(4) Electroplated formed diamond wheels for grinding magnetic materials
(1) Diamond wheel for centerless grinding
(2) Metal bond wheels for double-disc surface grinding
(3) Metal bond wheels for grinding rotary transformer cores
(4) Electroplated formed diamond wheels for grinding magnetic materials
Super Elastic Bond Wheels "ARVO"
Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.
Diamond Wheels for Various Wafer Surface Grinding
These diamond wheels are designed for surface grinding of various types of wafers, including those made from semiconductor materials and electronic device materials. We offer the optimal wheel for each specific material. They minimize damage caused by machining, helping to improve processing efficiency and reduce processing costs. Customization to meet your specific needs is available.