Search by Industry

Core drill with excellent accuracy and sharpness, suitable for various work materials such as LED substrate materials, semiconductor materials such as sapphire, ceramics, etc.

Thin-blade type band saw with diamond electroplated on a high-tensile steel band. It cuts large-diameter silicon ingots and other large-diameter work materials efficiently with high precision. It is also used for cutting carbon, ceramics, glass, and other materials, and can be manufactured in sizes compatible with various machines.
The segment type is suitable for cutting brittle materials and has excellent cutting performance and long life. It is especially suitable for high-precision and high-efficiency cutting of single crystal silicon.
The serrated type is widely used for wide products and demonstrates excellent sharpness for cutting difficult-to-cut materials, and is also ideal for cutting work materials that are prone to blade edge clogging.
The continuous type is used for a wide range of applications from narrow to wide products. The continuous electroplated layer on the cutting edge reduces saw marks on the cutting surface of the work material and is effective in cutting hard work materials.

"CREEPSTAR" for heavy grinding of tungsten carbide
"POLASTAR POLYX" for heavy grinding of tungsten
"ASPIRE METAL" for heavy grinding of tungsten carbide
SUN Athlete Series
"SUPREMO" High-performance metal wheel for Flute grinding of Carbide tools

Developed to expand the processing area of resin bond wheels, such as lapping, mirror finishing, polishing, etc., with a new bond with a special structure that has a high elasticity not found in conventional Bright Star type bonds.

High-performance wheels for dry grinding of tungsten carbide and high-speed steel. We have diamond resin bond wheels "Power Dry BPD Bond" with excellent sharpness and long life for dry grinding of tungsten carbide, and CBN resin bond wheels "Power Dry II BCD Bond" with excellent sharpness and long life for dry grinding of high speed steel.