- Business Units
- Electronics & Semiconductor
- Types of tools
- Cutting Tools
- Processing method
- Drilling
- Work
- Semiconductor materials, Precision mold materials
Product Details
Achieving miniaturization (φ0.3–1.5) of PCD drills essential for high-precision machining of hard and brittle materials like SiC and cemented carbide. The drill tip is entirely constructed of PCD, enabling long-life drilling with reduced chipping. Meeting the next-generation demands for semiconductor-related components, precision mold parts, and more.
Application
- Small-diameter hole drilling in brittle materials
Product characteristics
The unique cutting edge design enables high-durability drilling with reduced chipping.
◇Standard Specifications
| Cutting edge diameter (φ) DC | Groove Length (mm) LCF | Overall Length (mm) | Tip (mm) PL | Shank Diameter (φ) DCON |
|---|---|---|---|---|
| 0.3 | 6.5 | 38 | 0.12 | 3.0 |
| 0.4 | 6.5 | 38 | 0.18 | 3.0 |
| 0.5 | 6.5 | 38 | 0.23 | 3.0 |
| 0.6 | 6.5 | 38 | 0.27 | 3.0 |
| 0.7 | 6.5 | 38 | 0.29 | 3.0 |
| 0.8 | 6.5 | 38 | 0.34 | 3.0 |
| 0.9 | 6.5 | 38 | 0.40 | 3.0 |
| 1.0 | 6.5 | 38 | 0.49 | 3.0 |
| 1.1 | 6.5 | 38 | 0.56 | 3.0 |
| 1.2 | 6.5 | 38 | 0.60 | 3.0 |
| 1.3 | 6.5 | 38 | 0.66 | 3.0 |
| 1.4 | 6.5 | 38 | 0.73 | 3.0 |
| 1.5 | 6.5 | 38 | 0.80 | 3.0 |
◇Performance Introduction "φ0.45 Machining Data"
Target workpieces: SiC ceramics, quartz glass, etc.
Materials | SiC | Quartz glass |
|---|---|---|
| 1st hole |  |  |
| In process |  |  |
Lifespan Comparison (SiC Machining)
