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Announcement Regarding Our Participation in Grinding Technology Japan 2023

Diamond Wheels for Various Wafer Surface Grinding

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Regarding the Acquisition of the “Kurumin” Certification Mark

Notice Regarding Year-End and New Year Holidays

Notice Regarding the Resumption of Operations at the Chiba Tsurumai Plant

FY2023 2Q Financial Results Briefing post (2 MB)

SEMICON Japan 2022: Exhibition Announcement

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