Asahi Diamond Industrial Co., Ltd. will exhibit at " SEMICON JAPAN2023", the largest event in the semiconductor industry, from December 13 (Wed.) to December 15 (Fri.), 2023.
We are sincerely looking forward to seeing you at the exhibition.
Dates: Wednesday, December 13, 2023 - Friday, December 15, 2023
Opening hours: 10:00-17:00
Venue: Tokyo Big Sight
Booth No. East Hall 2, 2217
Official website https://www.semiconjapan.org/jp
Examples of exhibited products
1. Grinding Tools
(1) Grinding wheels for semiconductor substrates
(2) Tools for wafer periphery processing, etc.
2. Cutting Tools
(1) Electroplated wire "EcoMEP®"
(2) Dicing blades "Merius Metal®", "Polymine®", etc.
(3) Dressing boards "PRIDUSBOARD®", etc.
3. Polishing Tools
(1) CMP Conditioners "NEOgO®", "SUNRISER®", etc.
4. Introduction of New Technologies Utilizing the Properties of Diamond
(1) Diamond ball "Stylus"
(2) Metal-diamond composite heat sink
If you need to inquire about the above products in advance, please contact us from here.