Asahi Diamond Industries Co., Ltd. will be exhibiting at SEMICON JAPAN 2023,” the largest event in the semiconductor industry, from Wednesday, December 13, 2023, through Friday, December 15, 2023.
We sincerely look forward to seeing you there.
Dates: December 13 (Wed) – December 15 (Fri), 2023
Hours: 10:00 a.m. – 5:00 p.m.
Venue: Tokyo Big Sight
Booth Number: East Hall 2, Booth 2217
Official Website: https://www.semiconjapan.org/jp
◆ Examples of Products on Display
1. Grinding Tools
(1) Grinding wheels for semiconductor substrates
(2) Tools for wafer periphery processing, etc.
2. Cutting Tools
(1) Electroplated wire "EcoMEP®"
(2) Dicing blades "Merius Metal®", "Polymine®", etc.
(3) Dressing boards "PRIDUSBOARD®", etc.
3. Polishing Tools
(1) CMP Conditioners "NEOgO®", "SUNRISER®", etc.
4. Introduction of New Technologies Utilizing the Properties of Diamond
(1) Diamond ball "Stylus"
(2) Metal-diamond composite heat sink
If you need to inquire about the above products in advance, please contact us from here.