Asahi Diamond Industries Co., Ltd. will be exhibiting at SEMICON JAPAN 2025,” to be held at Tokyo Big Sight from Wednesday, December 17, 2025, through Friday, December 19, 2025. We will be showcasing new products and technologies, with a focus on diamond wheels and dicing blades for the semiconductor market.
We sincerely look forward to seeing you there.
- Date
- Wednesday, December 17, 2025 – Friday, December 19, 2025
- Time
- 10:00 a.m.–5:00 p.m.
- Place
- Tokyo Big Sight
- Booth number
- East Hall 4, Booth E4108
- Official Website
- https://www.semiconjapan.org/jp
Please pre-register before visiting.
Products on Display
Cutting Tools
Diamond wheel for SiC surface grinding "M-cloud®"
Wafer edge trimming wheel
Wafer edge trimming blades, etc.
Cutting Tools
Dicing blades for semiconductors "New-Merius Metal®", etc.
Diamond wire for wafer slicing "EcoMEP MHD®", etc.
Polishing Tools
CMP pad conditioner "NEOgO® SR"
New technology utilizing the characteristics of diamond
"Micro PCD Drill" and "PCD Multi Edge" small-diameter tools for processing hard and brittle materials
Diamond Wafer Grinding Wheels