Asahi Diamond Industrial Co., Ltd. will exhibit at " SEMICON JAPAN 2025" to be held at Tokyo Big Sight from December 17 (Wed.) to 19 (Fri.), 2025. We will exhibit our new products and technologies, mainly diamond wheels and dicing blades for the semiconductor market.
We are sincerely looking forward to seeing you at our booth.
- Date
- Wednesday, December 17, 2025 - Friday, December 19, 2025
- Time
- 10:00-17:00
- Place
- Tokyo Big Sight
- Booth number
- East 4 Hall E4108
- Official Site
- https://www.semiconjapan.org/jp
Please pre-register to attend.
Exhibit Products
Cutting Tools
Diamond wheel for SiC surface grinding "M-cloud®"
Wafer edge trimming wheel
Wafer edge trimming blades, etc.
Cutting Tools
Dicing blades for semiconductors "New-Merius Metal®", etc.
Diamond wire for wafer slicing "EcoMEP MHD®", etc.
Polishing Tools
CMP pad conditioner "NEOgO® SR"
New technology utilizing the characteristics of diamond
"Micro PCD Drill" and "PCD Multi Edge" small-diameter tools for processing hard and brittle materials
Diamond Wafer Grinding Wheels