Asahi Diamond Industrial Co., Ltd. will exhibit at " SEMICON JAPAN 2024" to be held at Tokyo Big Sight from December 11 (Wed.) to 13 (Fri.), 2024.
We will exhibit our new products and technologies, mainly diamond wheels and dicing blades for the semiconductor market.
We are sincerely looking forward to seeing you at our booth.
- Date
- Wednesday, December 11, 2024 - Friday, December 13, 2024
- Time
- 10:00-17:00
- Place
- Tokyo Big Sight
- Booth number
- East Hall 2, 2111
- Official Site
- https://www.semiconjapan.org/jp
| Examples of exhibited products |
|---|
| 1. Grinding tools |
| (1) Surface Grinding Wheel for Semiconductor Substrates " M-cloud®" |
| (2) Tools for wafer perimeter processing, etc. |
| 2. Cutting tools |
| (1) Electrodeposited wire " EcoMEP® ". |
| (2) Dicing blade "New Melius Metal®". |
| (3) Dress boards "Preduce Board®", etc. |
| 3. Polishing tools |
| (1)CMP Conditioner " NEOgO® SR ", etc. |
| 4. introduction of new technology utilizing the characteristics of diamond |
| (1) Micro PCD Drill, a tool for machining small diameter brittle materials |
| (2) Diamond wafer grinding wheels |
| (3) Metal diamond composite heat sink |
| If you need to make an inquiry about the above products in advance, please contact us. |