Asahi Diamond Industrial Co., Ltd. will be exhibiting at SEMICON JAPAN 2024,” to be held at Tokyo Big Sight from Wednesday, December 11, 2024, through Friday, December 13, 2024.
We will be showcasing new products and technologies, with a focus on diamond wheels and dicing blades for the semiconductor market.
We sincerely look forward to seeing you there.
- Date
- Wednesday, December 11, 2024 – Friday, December 13, 2024
- Time
- 10:00 a.m.–5:00 p.m.
- Place
- Tokyo Big Sight
- Booth number
- East Hall 2, Room 2111
- Official Website
- https://www.semiconjapan.org/jp
| ◆ Examples of Products on Display |
|---|
| 1. Grinding Tools |
| (1) “ M-cloud ” Surface Grinding Wheel for Semiconductor Substrates |
| (2) Tools for wafer edge processing, etc. |
| 2. Cutting tools |
| (1) Electroplated Wire “ EcoMEP® ” |
| (2) “New Melius Metal®” Dicing Blade |
| (3) Dress Board “Produce Board®” and others |
| 3. Polishing tools |
| (1)CMP Conditioner “NEOgO® SR ” and others |
| 4. Introduction to New Technologies That Leverage the Properties of Diamonds |
| (1) “ Micro PCD Drill ”—A Tool for Small-Diameter Machining of Hard and Brittle Materials |
| (2) Diamond grinding wheels for diamond wafers |
| (3) Metal-Diamond Composite Heat Sink |
| If you need to make an inquiry about the above products in advance, please contact us. |