On March 31, 2025, Asahi Diamond Industrial Co., Ltd. (hereinafter referred to as “Asahi Diamond”) and Tokyo Seimitsu Co., Ltd. (hereinafter referred to as “Tokyo Seimitsu”) have signed a Joint Venture Agreement to establish a joint venture company to develop, manufacture and sell hub blades, one of the dicing blades used for dicing machines, in accordance with the memorandum of understanding concluded on January 8, 2025.
Details of the joint venture company will be announced promptly after its establishment.