Productstaglist

  • “EcoMEP” Electroplated Wire : for slicing silicon ingots
    “EcoMEP” Electroplated Wire : for slicing silicon ingots
    Electroplated diamond wire, EcoMEP, is a small-diameter, high-strength wire that has been electroplated with diamond grains using a special technique. It can be used to cut multiple slices of hard bri...
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  • Electroplated Diamond Band Saws
    Electroplated Diamond Band Saws
    Thin-band saws (consisting of an endless, high-strength steel band with an electroplated diamond cutting edge) is capable of cutting large-diameter silicon ingots and other large diameter materials ac...
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  • Diamond Wheels (Peripheral Grinding / Orientation Flat Processing)
    Diamond Wheels (Peripheral Grinding / Orientation Flat Processing)
    Metal bond wheels are used for the peripheral grinding of silicon ingots, or processing orientation flats to show the crystal orientation and processing notches. Based on our past experience in variou...
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  • ID Blades Slicing Silicon Ingots
    ID Blades Slicing Silicon Ingots
    ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also ...
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  • Diamond Wheels (Edge Grinding & Notch Grinding : for silicon wafers)
    Diamond Wheels (Edge Grinding & Notch Grinding : for silicon wafers)
    Metal bond diamond wheels are used for edge grinding of silicon wafers. For notch grinding of large-diameter wafers, a small-diameter formed wheel is employed. ...
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  • Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners
    Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners
    Chemical mechanical polishing (CMP) helps smooth wafer surfaces, an important part of VLSI production. Conditioning is essential to assure stable CMP grinding. Asahi Diamond offers a variety of CMP co...
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  • Diamond Wheel for Surface Grinding of Various Wafers
    Diamond Wheel for Surface Grinding of Various Wafers
    This diamond wheel is for surface grinding various wafers such as those for semiconductor materials and electronic devices. We supply the optimum diamond wheel for each material. It helps minimize pro...
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  • Notch Grinding Wheels
    Notch Grinding Wheels
    Small-diameter formed wheels are used to finish the notches of Large-diameter wafers. Our notch grinding wheels maintain the run out accuracy of diamonds to the shank, and prduce a favorable wafer cir...
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  • Electroformed Hub-Type Dicing Blades
    Electroformed Hub-Type Dicing Blades
    Hub-type electroformed blades are used for dicing patterned wafers. Because they have aluminum alloy hubs, they can be used more easily than ring-type blades. Not only can the specifications for our d...
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  • Electroformed Hubless-Type Dicing Blades
    Electroformed Hubless-Type Dicing Blades
    Hubless-type blades are suitable for various cutting grooving applications, such as silicon wafers, compound semiconductor wafers, etc. Nickel plating is the bonding material and with the proper diamo...
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