Product Infomation

“SILKY STAR” : for finish grinding

By using SILKY STAR, a vitrified bond wheel with ultrafine diamond abrasives, wafers can be thinned very easily. It also reduces the roughness of the finish surface of the wafer and damage from grinding. We provide the bond specifications best suited to the machines used, the conditions of processing, and the level of precision required.

use
  • Finishing silicon, SiC and other crustaceous wafers
  • Contact Us

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