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Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners

Chemical mechanical polishing (CMP) helps smooth wafer surfaces, an important part of VLSI production. Conditioning is essential to assure stable CMP grinding. Asahi Diamond offers a variety of CMP conditioners to suit diverse wafer shapes and specifications.

Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners

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  • CMP conditioning
  • Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners
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