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ID Blades Slicing Silicon Ingots

ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice glass, ceramics, and other hard materials.

ID Blades Slicing Silicon Ingots

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  • Slicing semiconductor materials, glass and magnetic materials
  • ID Blades Slicing Silicon Ingots
  • ID Blades Slicing Silicon Ingots
  • ID Blades Slicing Silicon Ingots
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