Product Infomation

“EcoMEP” Electroplated Wire : for slicing silicon ingots

Using a unique electroplating technology Asahi is able to diamond coat high tensile wire very precisely. This manufacturing technology provides a significant improvement over conventional slurry type wire saw. Observed advantages are reduced cutting time, less kerf loss, improved flatness when sawing silicon, sapphire and other hard, brittle materials.

  • Slicing silicon,sapphire and other crustaceous materials
  • Contact Us

Page Top