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Electroformed Hubless-Type Dicing Blades

Ring type blades are suitable for various cutting grooving applications, such as silicon wafers, compound semiconductor wafers, etc. Nickel plating is the bonding material and with the proper diamond size, blades as thin as 15μm are available. The various specifications available make it possible to choose the best blade for your requirements.

Electroformed Hubless-Type Dicing Blades

use
  • Grooving and cutting silicon for semiconductors, compound wafers, electronic materials, etc.
  • Electroformed Hubless-Type Dicing Blades
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