Product Infomation

Electroformed Hub-Type Dicing Blades

Hub-type electroformed blades are used for dicing patterned wafers. Because they have aluminum alloy hubs, they can be used more easily than ring-type blades. Not only can the specifications for our dicing blades be set according to the client’s needs, but the blades can also handle materials that are difficult to find, such as wafers with metallic film, by using specially-treated blade edges.

Electroformed Hub-Type Dicing Blades

use
  • Dicing silicon for semiconductors and compound wafers
  • Electroformed Hub-Type Dicing Blades
  • Electroformed Hub-Type Dicing Blades
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