Productstaglist

  • Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners
    Bonding of IC Chips (Wire Bonding, TAB* & Flip Chip Bonding) CMP Conditioners
    Chemical mechanical polishing (CMP) helps smooth wafer surfaces, an important part of VLSI production. Conditioning is essential to assure stable CMP grinding. Asahi Diamond offers a variety of CMP co...
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  • Back Grinding of Wafers Diamond Wheels : for back grinding of wafers
    Back Grinding of Wafers Diamond Wheels : for back grinding of wafers
    By using a diamond wheel for back grinding of patterned silicon wafers, it is possible to obtain a smooth, surface finish with minimum working load. ...
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  • “SILKY STAR” : for finish grinding
    “SILKY STAR” : for finish grinding
    By using SILKY STAR, a vitrified bond wheel with ultrafine diamond abrasives, wafers can be thinned very easily. It also reduces the roughness of the finish surface of the wafer and damage from grindi...
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  • Electroformed Hub-Type Dicing Blades
    Electroformed Hub-Type Dicing Blades
    Hub-type electroformed blades are used for dicing patterned wafers. Because they have aluminum alloy hubs, they can be used more easily than ring-type blades. Not only can the specifications for our d...
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  • Electroformed Hubless-Type Dicing Blades
    Electroformed Hubless-Type Dicing Blades
    Ring type blades are suitable for various cutting grooving applications, such as silicon wafers, compound semiconductor wafers, etc. Nickel plating is the bonding material and with the proper diamond ...
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  • Ultra-Precise Cutting Tools (Monocrystal Diamond Tools)
    With high-precision processing technologies using monocrystal diamond, we have produced sharp cutting edges and nano-order contour accuracy also in the ultra-precise cutting market. They are used, for...
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  • Precision Cutting Wheels (Non-Core Type)
    Precision Cutting Wheels (Non-Core Type)
    To work on precision electronic parts, a thin cutting wheel is required. Asahi Diamond's non-core type wheels are hubless and highly precise. The wheels are commonly used with dicing machines or high ...
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  • Precision Cutting Wheels (Multi-Set Type)
    Precision Cutting Wheels (Multi-Set Type)
    The multi-cutter type precision cutting wheel can cut and groove mass-produced articles with high precision. It is important to match the wheel precision, multi-setting technology and selection of whe...
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  • Sintered Cutting Wheels (Single type)
    Sintered Cutting Wheels (Single type)
    Single type cutting wheels have a steel core with a diamond or CBN abrasive grain on the outer rim. Available with various selections of grains (diamond or CBN), bond (metal, resin, electroplated), cu...
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  • “SUNNOVEL” High Elasticity Metal Bond
    “SUNNOVEL” High Elasticity Metal Bond
    High elasticity metal bond blades combine the strength of a metal bond with the cutting performance of a resin bond blade....
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