Products
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- “EcoMEP” Electroplated Wire : for slicing silicon ingots
- Electroplated diamond wire, EcoMEP, is a small-diameter, high-strength wire that has been electroplated with diamond grains using a special technique. It can be used to cut multiple slices of hard bri...
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- “SOLOTERU” Metal Grinding Wheel with Uniform Distribution of Abrasive Grains
- The use of a technique for ensuring an even distribution of abrasive grains within the abrasive layer delivers improved cutting performance together with long life compared to the metal tools traditio...
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- Electroplated Diamond Band Saws
- Thin-band saws (consisting of an endless, high-strength steel band with an electroplated diamond cutting edge) is capable of cutting large-diameter silicon ingots and other large diameter materials ac...
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- Diamond Wheels (Peripheral Grinding / Orientation Flat Processing)
- Metal bond wheels are used for the peripheral grinding of silicon ingots, or processing orientation flats to show the crystal orientation and processing notches. Based on our past experience in variou...
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- ID Blades Slicing Silicon Ingots
- ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also ...
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- OD Blades : for MONO & MULTI crystalline silicon ingot bricks
- Used for end-cutting, removing brick inclusions and squaring MONO and MULTI silicon. ...
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- “SUNCREA” High Efficiency Metal Bond for Difficult-to-machine Materials
- SUNCREA realizes sharpness and service life which could not be obtained with conventional metal bonds in sapphire, carbide, hard brittle materials such as ceramics and ferrite, hard magnetic materials...
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- Core Drills : for sapphire
- Used for coring sapphire for LED substrates...
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- Diamond Wheels (Edge Grinding & Notch Grinding : for silicon wafers)
- Metal bond diamond wheels are used for edge grinding of silicon wafers. For notch grinding of large-diameter wafers, a small-diameter formed wheel is employed. ...
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- Diamond Wheel for Surface Grinding of Various Wafers
- This diamond wheel is for surface grinding various wafers such as those for semiconductor materials and electronic devices. We supply the optimum diamond wheel for each material. It helps minimize pro...