Product Information

Thin wafers

[Thin wafers]

Thin wafers’ thickness is limited to 100 micrometers or less. Demand for such thin wafers mainly for mobile phones has been growing rapidly. High-quality processing is required for dicing thin wafers to secure the strength of chips.

[Adaptive blades]

[Case study]

The following is an example of the processing of thin wafers. We provide appropriate blades and processing techniques covering precutting to solve problems.

Processing requirements

Workpiece Φ8″ Si 0.05mmT
Blade Electroforming Blades (Hub-Type)
Mesh Size #4000, Low-intensity product
Feed Rate 50mm/sec

Comparative chipping data

Comparative chipping data

*Please ask our competent staff for details including blade specifications and processing methods.

  • Contact Us

Page Top