Thin wafers
[Thin wafers]
Thin wafers’ thickness is limited to 100 micrometers or less. Demand for such thin wafers mainly for mobile phones has been growing rapidly. High-quality processing is required for dicing thin wafers to secure the strength of chips.
[Adaptive blades]
[Case study]
The following is an example of the processing of thin wafers. We provide appropriate blades and processing techniques covering precutting to solve problems.
Processing requirements
Workpiece | Φ8″ Si 0.05mmT |
---|---|
Blade | Electroforming Blades (Hub-Type) Mesh Size #4000, Low-intensity product |
Feed Rate | 50mm/sec |
Comparative chipping data
*Please ask our competent staff for details including blade specifications and processing methods.