LTCC substrates
[LTCC substrates]
The LTCC (Low Temperature Co-fired Ceramic) represents multi-layer ceramic technology* for higher functionality of substrates (lighter and thinner). LTCC substrates can be sintered at low temperatures, allowing low-melting-point materials (including Ag and Cu) to be used as internal terminals. They thus feature high-density interconnection, high heat resistance, and high humidity resistance.
*While multi-layer substrates made of conventional alumina ceramics are sintered at between 1,200 and 1,500°C, LTCC substrates can be sintered at 1,000°C or less with foreign matter added to alumina.
[Adaptive blades]
[Case study]
Following is an example of our “Sun Novel” highly elastic metal blade being used for the processing of LTCC substrates.
Processing requirements
Workpiece | LTCC substrates 0.5mmT |
---|---|
Blade | High elasticity metal bond blade “SUN NOVEL” Mesh Size #600 O.D. φ52mm Blade thickness at 0.15mm |
Feed Rate | 7mm/sec |
Cut resistance (relative value)
*Please ask our competent staff for details including blade specifications and processing methods.